Features:
Heated Bed Power Module
Based on powerful MOSFET HA210NO6
Size:60*50mm
Mounting Holes: Diameter 3.2mm, For M3 Screws
Distance between holes: 2.1 x 1.7 inches (54 x 43 mm)
Super powerful MOSFET that can withstand higher current than normal RAMPS or other 3D printer controllers can handle
Voltage: 12V-24V
Maximum current for active cooling: 210A
Current: 50-80A for long time without active cooling
This module is based on the Power MOSFET, which allows for PID control of heated beds (DC-DC relay usually does not allow this).
Includes:
1 x Heated Bed Power Module
1 x connection cable for input signal