High Temperature Tape, 13.8 x 0.06 mm (250 - 300 °C) Heat Resistant Tape High Insulation Heat Resistant Adhesive Tape for BGA Chip Welding
Features:
High temperature resistance of 300 degrees Celsius in short term and long term high temperature resistance of 250 degrees Celsius.
With a high extension of over 35% and high peel strength up to 5N/25mm, this heat-resistant adhesive tape can be used for a very long time.
High insulation ensures safety.
Uses a special adhesive that has a strong bond and leaves no residue after peeling.
13.0 x 0.02 inches (33 x 0.55 mm) thermal adhesive tape suitable for BGA tip welding.
Specifications:
Product Type: -Thermal Adhesive Tape.
Thickness: Approx. 0.06mm
Length: Approx. 33m
Elasticity: ≥35%
Peel strength: 5N / 25mm
Tensile Force: 135N / 25mm
Heat resistance: Long duration: 592°F (250°C); Short time: 882°F (300°C).
Width: 20mm, 30mm, 50mm for choice
Package Size: Approx. 9.5 * 9.5 * 2cm / 3.74 * 3.74 * 0.79in
Package weight: 47g
Package List:
1 x Thermal adhesive tape.