Certified to – 263 – Set of 2 heat sink for heat transfer glue adhesive sheet
Heat transfer adhesive sheets stick proceed to – 263 heat sink for 2 PCs set.
This product can be used to – 263 tip Apply directly to the body as the
Our custom heat sink on their own.
Commonly used in to the IC has DAP and board of your packaging – 263 notebook to stick with lead free solder
The cooling effect and turn up to ensure the using environment
Its not just the heat dissipation in the wardrobe. When youre at your will
This Black Resin Surface The heatsink on the IC of the paste will help
For a more effective heat dissipation to which they are attached.
This heatsink is suitable for the size of the IC and resin surface than the size (9x9 mm)
Long rectangular (9x12 mm), will be more cooling effect thanks to the design and to
Extra security for your ever after. Please note that the longer the minute heat sink could be slightly
Out, adhesive sheets are resin surface shapes and sizes (9x9 mm) and with the same size
Cut-out to the surface allowing for long term when using the suction of your dust etc.
Although it is not to cause. Detailed Parts are attached, but
Extra Components Not on the market, so you can make up a little bit with the why Choice.
Optimized for the sizes to the still is to – 263,
If Each Other To Size you can use for various occasion.
[Product specifications]
Housing material: aluminum alloy
Color: Silver
hi-tosinkusaizu: Vertical 12 mm x Width 9 mm x Thickness 5.3 mm (tape thickness: included)
Heat transfer on the adhesive sheet size: 9 mm x 9 mm (individual differences)
[Please note]
When mounting the IC from the mounting locations for degreasing/cleaning and installation.
Is a universal heat sink. All purpose for proper heat dissipation can be removed.
When using the heat retention before, you can operating you your home robot operating at peak performance.
Also please please be careful not to short circuit caused by in the place of the circuit.
Electronic Parts for sale so basically the warranty is not available.