[1 KADA 853B]

853B Welding Station for BGA PCB 540W Preheating Station BGA Recycling Station Preheat/Hot Air Solder Removal Station

Features:
1. Fast heating, can reach the setting temperature in just seconds, continuous work, better than similar products.
2. Built-in temperature sensor, temperature stability;
3. It has 850D, 852D+ hot air pull and 942.936 anti-static soldering station, with fast solder removal capabilities such as maximum chip class (BGA).
4.Suitable for factory and corporate circuit maintenance, telephone control board, computer motherboard repair.

Technical Parameters:
Temperature range: 100 - 350
Air flow range: 0.18m3/min
Output Power: 540W
Instructions:
PCB board set in outlet center Depending on the size of the element, circuit board thickness, and tin melting point of PCB substrate
Set the temperature (temperature setting is very important for mastering Temperature setting may cause damage to PCB
The temperature should be too high. Otherwise, the PCB board will deform and burn the reverse side. If the temperature is too low, the components will be down).
When the power switch and heating switch is turned on, the temperature rises, and immediately the tinned point of the element reaches and melts and removes the element.
Note: Therefore, if the solder point of each element of PCB pin is near the melting point, please do not remove the PCB board immediately.
First you need to turn off the heat switch and cool down the PCB board to room temperature.