Feature

●FN1797 Japanese Authorized Distributor Product No Warranty
●13.3W/m K thermal conductivity ensures rapid cooling of high-temperature equipment
●Non-conductive electricity, heat resistant, hard to harden, safe to use
●Bonds seamlessly to the surface of your device
●It can be used on a variety of devices that require cooling, such as electronics, motherboards, parts (CPU, GPU, USICS, hard drives, disk drives, IGBT modules) and laptops


Description

The Thermal Pad series is a revolutionary alternative to traditional grease for a wide range of electronics and parts. Formulated with zinc nano-oxide and nano-alumina, it boasts a thermal conductivity of 13.3W/m K and can cool quickly.
Product Size: 3.7 x 1.8 inches (95 x 45 mm)
Thermal conductivity: 13.3 (W/m.K)
Color: Purple
Density: 3.4±0.2g/cc
Hardness: 30 - 60 Sc
Leveling Voltage: 6KV (0.04 inch (1 mm)
Operating Temperature: -40 - 200 degrees Celsius