1. High temperature resistance, low temperature resistance, good thermal conductivity.
2. Soft, low viscosity.
3.Can also be used for heat transfer of CPU chip and LED heat transfer.
4. Good heat conduction, very malleable
5. Can be cut to any size.
Specifications:
Description:
100% brand new and high quality. The pads can be cut to different sizes if needed. Free installation, maximum heat conduction, and improved cooling. Ideal for graphics cards, graphic chips, north bridge chips, memory chipsets, and ICs.
Features:
1. High temperature resistance, low temperature resistance, good thermal conductivity.
2. Soft, low viscosity.
3.Can also be used for heat transfer of CPU chip and LED heat transfer.
4. Good heat conduction, very malleable
5. Can be cut to any size.
Specifications:
Condition: 100% Brand New
Material: Silica gel
Color: Blue
Size: Approx. 100 * 100 * 3 mm / 3.9 * 3.9 * 0.1 inch
Thermal Conductivity: 5.0
Density: 2.35
Hardness: 13c - 50c
Dielectric Factor: 260±18
Temperature: -40°C - 220°C
Voltage resistance: > 4kv
Fire Retardant: UL94 V0
Tensile Strength: (PSI) ≥ 35
Package Includes:
>1 x CPU Thermal Pad
Note