Description:
100% brand new and high quality. The pads can be cut to different sizes if needed. Free installation, maximum heat conduction, and improved cooling. Ideal for graphics cards, graphic chips, north bridge chips, memory chipsets, and ICs.
Features:
1.High temperature resistance, low temperature, good thermal conductivity.
2. Soft, low viscosity.
3.Can be used for heat transfer of CPU chip or LED heat transfer.
4.Good heat conduction, excellent ductility
5.Can be cut
Specifications:
Condition: 100% Brand New
Material: Silica gel
Color: Blue
Size: Approx. 100 * 100 * 3mm / 3.9 * 3.9 * 0.1in
Thermal Conductivity: 5.0
Density: 2.35
Hardness: 13c - 50c
Dielectric Factor: 260±18
Temperature: -40° C - 220°C
Voltage resistance: > 4kv
Fire Retardant: UL94 V0
Tensile Strength: (PSI)≥35
Package Includes:
1 x CPU Thermal Pad
Remarks:
1. Please allow 1-3cm error due to manual measurement. Thanks for your understanding.
2. Item shown in pictures is not calibrated same.