Feature

●The PTM7950 series is preferred for high performance integration because it provides superior reliability (passes 150˚C baking time, T/C-B cycle) and a proprietary material that maintains low heat impedance (<0.04˚Ccm2/W @ Shim). Circuit Devices
●PTM7950 is a super high thermal conductive phase change material (PCM) in both pad and paste. Designed to minimize thermal resistance on interface, maintain superior performance through reliability testing, and provide scalable applications at competitive cost
●Based on a new polymer PCM system, the PTM7950 shows excellent surfactor in typical operating temperature ranges, and has very low surface contact resistance. Material must pass through phase change temperature for qualified performance
●PRODUCT APPLICATIONS: For optimal performance, clamping pressure and temperature is recommended to minimize the thickness of the adhesive line of heat conductive materials. Generally less than 1.5 mil (0.038 mm)
●Specifications: <br/>Material: Silicone <br/>Dimensions: 31X50MM, 40X40MM, 40X80MM, 80X80MM, 80X160MM (Optional) <br/>Heat Resistance: 0.04°C - cm2/W <br/>Thermal conductivity: 8.5W/mk <br/>Thickness: 0.25mm <br/>Line End 0.04℃-cm2/W <br/>Bake: 150℃, 1000h 0.04℃-cm2/W <br/>Double 85, 1,000h 0.04℃-cm2/W <br/>Temperature Cycle "B" (-55˚C ~ +125˚C, 1000 Cycle) 0.045˚C-cm2/W


Description

1 Piece PTM7950 Thermal Pad, Laptop Phase Changing Silicone Grease Pad, CPU GPU Thermal Conductive Paste Gasket Patch Thermal Conductive Paste
Features:
Brand new and high quality
PTM7950 is a super high thermal conductive phase change material (PCM) in both pad and paste. Designed to minimize thermal resistance on interface, maintain superior performance through reliability testing, and provide scalable applications at competitive cost.
Based on a new polymer PCM system, the PTM7950 shows excellent surfactor in typical operating temperature ranges, and has very low surface contact resistance.
The PTM7950 series is preferred for high performance integration because it provides superior reliability (passes 150˚C baking time, T/C-B cycle) and a proprietary material that maintains low heat impedance (<0.04˚Ccm2/W @ Shim). Circuit Devices
PRODUCT APPLICATIONS: For optimal performance, clamping pressure and temperature is recommended to minimize the thickness of the adhesive line of heat conductive materials. Generally less than 1.5 mil (0.038 mm)
Material must pass through phase change temperature for qualified performance.



Package Includes:
1 x PTM7950 Thermal Pad
1 x Sticker

Note:
This product is a phase change material. Due to the cabin and regional climate, the edge of the product may be slightly deformed, but it does not affect normal use.
Please allow 1-3mm error due to human nature.