1.High temperature resistance, low temperature, good thermal conductivity.
2.Soft and low viscosity
3.Can be used for heat transfer of CPU chip or LED heat transfer.
4.Good heat conduction, very good malleable
5. Can be cut to any size.
Specifications:
Description:
100% Brand New & High Quality The pads can be cut to different sizes if needed. Free installation, maximum heat conduction, and increased cooling Ideal for graphics cards, graphic chips, north bridge chips, memory chipsets, and ICs.
Features:
1.High temperature resistance, low temperature, good thermal conductivity.
2.Soft and low viscosity
3.Can be used for heat transfer of CPU chip or LED heat transfer.
4.Good heat conduction, very good malleable
5. Can be cut to any size.
Specifications:
Condition: 100% Brand New
Material: Silica gel
Color: Blue 100 * 100 * 3mm / 3.9 * 3.9 * 0.1in
Thermal Conductivity: 5.0
Density: 2.35
Hardness: 13c - 50c
Dielectric Factor: 260±18
Temperature: -40° C - 220°C
Withstanding Voltage: >4kv
Fire Retardant: UL94 V0
Tensile Strength: (PSI) ≥ 35
Package Includes:
1 x CPU thermal pad
Note:
1.Please allow 1-3cm error due to manual measurement. Thanks for your understanding.