Feature

●[13.8W / mK Thermal Conductivity] Thermal conductivity, upgraded thermal silicone material, 13.8W / mK thermal conductivity greatly improves the heat transfer between electronic components, effectively cools the temperature within seconds
●[High Temperature Performance] Super reliable and durable, no melting at high temperature performance from -40℃ to 200℃, non-toxic, odorless, corrosion resistant, anti-static, flame retardant, compression, good insulation, traces of electrical contact will not cause any kind of damage
●[Scope of application] GPU thermal pad is a perfect alternative to traditional heatsink compound grease, suitable for electronic products, CPU, GPU, heatsink, power LED, computer host, notebook computer, LED IC SMDDIP and any cooling module
●Voltage Adjustment Module: Voltage regulating module for DSP and DSP, high speed capacity storage can drive high calories and high thermal conductivity module for BGA
●[Wide Application] Thermal pad is used between notebook and desktop graphics card IC, CPU and motherboard NorthSouth bridge and heatsink between hard disk and shell, between cooling components and chassis or chassis

[4.7 x 0.8 x 0.08 inches (120 x 20 x 2]




[120 * 20 * 0.5mm]




[120 * 20 * 2.5mm]




[120 * 20 * 3.0mm]





Description

Function:
1 [13.8W / mK Thermal Conductivity] Thermal conductivity, upgraded thermal silicone material with 13.8W / mK thermal conductivity. This greatly improves the heat transfer between electronic components and effectively cools the temperature within seconds.
2. [High Temperature Performance] Super reliable and durable, no melting at high temperature performance from -40℃ to 200℃, non-toxic, odorless, corrosion resistant, anti-static, flame retardant, compression, good insulation, traces of contact with electricity will not cause any kind of damage.
3 [Scope of application] GPU thermal pad is a perfect alternative to traditional heatsink compound grease, suitable for electronic products, CPU, GPU, heatsink, power LED, computer host, notebook computer, LED IC SMDDIP and any cooling module. a> 4 [Voltage Regulating Module] Voltage regulating module for DSP and DSP, high speed capacity storage drive high calorie high thermal conductivity module for BGA
5 [Wide Application] Thermal pad is used between notebook and desktop graphics card IC, CPU and motherboard NorthSouth bridge and heatsink between hard disk and shell, between cooling components and chassis or chassis.


Specifications:

Item Type:Thermal Pads
Material: Silicone.
Thermal conductivity: 13.8W / mk
Density: 3.3±0.1
Hardness: 40-80 Sc
Breakdown Voltage: > 6KV / mm
Heat resistance: -40° to 200℃
Compatible Devices: Laptop, Desktop





Package List:
1 x Thermal Pad