[3.5 x 2.4 x 0.1 inches (90 x 60 x 2]

[90 * 60 * 0.5mm]

[90 * 60 * 1.5mm]

Function:
1 Applicable Scope: Suitable for electronic products, CPU, GPU, Power LED, Computer Host, Laptop, LED IC SMD dip, and any cooling module
2. Excellent Performance: Upgraded thermal silica gel material with 13.8w/mk thermal conductivity. This greatly improves the heat transfer between electronics and cools temperature effectively in seconds
3 Wide application: Used between notebook and desktop graphics card IC, CPU, hard disk and shell, cooling components and chassis
4 Excellent Heat Insulation: ‑ 40℃ to 200℃ high temperature performance, no heat dissipation, non-toxic, tasteless, corrosion resistant, wear-resistant, anti-static, flame retardant, compression, and excellent insulation
5 Built-in module: voltage regulating module for DSP, high speed and large capacity storage drive module with high heat BGA and high thermal conduction requirements


Specifications:

Item Type:Thermal Pads
Material: Silicone.
Thermal conductivity: 13.8W / mk
Density: 3.3±0.1
Hardness: 40-80 Sc
Insulation Breaking Voltage: > 6 KV / mm
Heat resistance: -40°C - 200°C
Size:
90 x 60 x 0.5mm / 3.5 x 2.4 x 0.02in
90x 60 x 1.0mm / 3.5 x 2.4 x 0.04in a> about 90 x 60 x 1.5mm / 3.5 x 2.4 x 0.06in
90 x 60 x 2.0mm / 3.5 x 2.4 x 0.08 inch
90 x 60 x 2.5mm / 3.5 x 2.4 x 0.1inch
Approx 90 x 60 x 3.0mm / 3.5 x 2.4 x 0.12in
Compatible Devices: Laptop, Desktop




Package List:
1 x Thermal Pad