Feature

●Excellent Performance: Upgraded thermal silica gel material with excellent thermal conductivity, 13.8w/mk thermal conductivity. This greatly improves the heat transfer between electronic components and effectively cools the temperature in seconds
●Applicable Scope: Suitable for electronic products, CPU, GPU, Power LED, Computer Host, Laptop, LED IC SMD dip, and any cooling module
●Excellent Heat Insulation: ‑ 40℃ to 200℃ high temperature performance, no heat dissipation, non-toxic, tasteless, corrosion resistant, anti-static, flame retardant, compression, and good insulation. Contact with electrical tracing will not cause any shape of damage
●Built-in module: voltage regulating module for DSP, high speed and large capacity storage drive module with high heat BGA and high thermal conduction demand
●Wide application: Used between notebook and desktop graphics card IC, CPU, hard disk and shell, cooling components and chassis

[2.5mm]

[2.0mm]

Description

Specifications:
Item Type:Thermal Pads
Material: Silicone
Thermal conductivity: 13.8W / mk
Density: 3.3±0.1
Hardness: 40-80 Sc
Insulation Breaking Voltage: > 6 KV / mm
Heat resistance: -40°C to 200°C
Size:
Approx. 30 x 30 x 0.5mm / 1.2 x 1.2 x 0.02in
Approx 30x 30 x 1.0mm / 1.2 x 1.2 x 0.04in
Approx. 30 x 30 x 1.5mm / 1.2 x 1.2 x 0.06in
Approx. 30 x 30 x 2.0mm / 1.2 x 1.2 x 0.08in
Approx. 30 x 30 x 2.5mm / 1.2 x 1.2 x 0.1in
Approx. 30 x 30 x 3.0mm / 1.2 x 1.2 x 0.12in
Compatible Devices: Laptop, Desktop
Package List:
1 x Thermal Pad