Thermal conductivity 12.8 W/mk
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A great value heat sink that can be used for heat protection for rectangular electronics.It can be used for heat dissipation in M.2 SSD, wireless module, IC chip, power adapter, precision equipment, internal substrate, CPU and various small electronic devices.Rapid heat dissipation for precision equipment, internal substrate, CPU heat dissipation, reduces damage to precision electronic products, protects electronic products, and extends the life of electronic products. The principle of heat dissipation electronic products generate a certain amount of heat during use, which is released directly into the surrounding air, and the air has a low thermal conductivity, thus preventing the heat emission of heat.Place the thermal conductive silicone sheet between the heat source and the heat sink to extrude air from the contact surface.The temperature difference on the surface of the electronic product can be reduced as much as possible. Product Attributes: Double-sided protective film that has a strong plasticity like clay, and can be used for filling.The material of this product is soft, good compression performance and heat dissipation, the thickness can be adjusted to a wide range of thicknesses, suitable for filling cavities, both sides have natural viscosity and strong operability and maintenance. Dimension: 120X120X2mm