Feature

●Specifications are marked on the surface, convenient to select
●These stencils are made of high quality 304 stainless steel and the thickness of the steel mesh is perfect
●Specifically designed for all kinds of BGA chips, such as laptops, desktops, communication mainboards, north bridge and graphic cards.
●5 different sizes and 33 pieces in total, meet your different needs
●They can be heated by a hot air machine, and these stencils will not easily deformed when heated.


Description

These stencils are made of high quality materials and can be heated with a hot air machine to reball BGA IC easily and quickly.

Function:
These stencils are made of high quality stainless steel and the thickness of the steel mesh is perfect. They can be heated by a hot air machine, and these stencils are hard to deform when heated. 5 sizes and 33 pieces in total, meet your different needs. Specifications are engraved on the surface and are available in your choice Specifically designed for all kinds of BGA chips, such as laptops, desktops, communication mainboards, north bridge and graphic cards.
Specifications:
Material: Stainless Steel
Color: Silver
Quantity: 33 pieces
Weight: Approx. 2.2 oz (61 g).

Package List:
2 x BGA stencils for 0.35mm solder balls
1 x BGA Stencil for 0.4mm solder balls
14 x BGA Stencils for 0.5mm solder balls
13 x BGA stencils for 0.6mm solder balls
3 x BGA stencils for 0.76mm solder balls