Feature

●Apply between CPU and heat sink etc., to increase the efficiency of thermal conduction
●Nano Diamond Powder Formula
●Excellent thermal performance due to extremely low thermal resistance
●Syringe type that is easy to handle. Keep out of reach of children. Avoid contact with skin and eyes


Description

Apply between the CPU and heat sink to increase the efficiency of the thermal conduction.
Nano diamond powder formula.
Excellent thermal performance due to its very low thermal resistance.
Syringe type that is easy to handle.

Keep out of reach of children.
※Avoid contact with skin and eyes.
■ Composition: Silicone, metal oxide
■ Contents: 0.08 oz (2.0
■Thermal conductivity: 8W/mK
■ Size: W20 x D20 x H80 mm
■Weight: 0.3 oz (8