Feature

●Apply between CPU and heat sink etc., to increase the efficiency of thermal conduction
●The thermal conductivity is 16W/mK and is ideal for high spec CPUs
●Nano Diamond Powder Formula
●Excellent thermal performance due to extremely low thermal resistance
●Syringe type that is easy to handle


Description

Apply between the CPU and heat sink to increase the efficiency of the thermal conduction.
The thermal conductivity is 16W/mK and is ideal for high-spec CPUs.
Nano diamond powder formula.
Excellent thermal performance due to its very low thermal resistance.
Syringe type that is easy to handle.
Comes with a handy spatula for applying grease.

Keep out of reach of children.
※Avoid contact with skin and eyes.
■ Composition: Nano diamond, silicone, metal oxide
■ Contents: 0.1 oz (3.0 g).
■Thermal conductivity: 16W/mK
■ Size: W23 x D13 x H120mm
■Weight: 0.3 oz (8